Production Readiness

DFM / DFT Review

We analyse your PCB layout against your target fab's process window and your test strategy before you commit to production — so you fix problems at zero cost instead of at respin cost.

What We Deliver

DFM Analysis

Full review of trace widths, clearances, via annular rings, solder mask slivers, acid traps, and tombstoning risk — benchmarked against your fab's process capabilities.

DFT Strategy

Test point placement audit, ICT fixture compatibility review, boundary scan (JTAG) integration, and functional test access planning to maximise fault coverage.

Stackup Verification

Confirm impedance targets, dielectric thicknesses, and copper weights match your signal integrity requirements and chosen laminate materials.

Fabrication Notes

Detailed fab notes covering surface finish, via fill, controlled impedance callouts, material spec (IPC-4101), and IPC class requirements.

Assembly Documentation

Pick-and-place files, paste stencil aperture review, assembly drawings, and polarity callouts optimised for automated SMT lines.

Risk Reporting

FMEA-style risk report highlighting high-severity issues with prioritised corrective actions and expected yield impact.

Our Process

1

Design Intake

You share Gerbers, ODB++, schematic, BOM, and any fab/assembly constraints. We confirm scope and turnaround.

2

DFM Audit

Automated DRC plus manual review against your target fab's design rules. Every violation is catalogued by severity.

3

DFT Audit

Test point coverage mapping, ICT clearance checks, and boundary scan node review to confirm the board can be tested efficiently.

4

Corrections & Recommendations

We return a marked-up report with corrective actions. Critical issues include recommended Gerber edits; advisory issues are documented for your team.

5

Re-Review (if needed)

After you apply corrections we perform a quick re-check to confirm all critical issues are resolved before you release to fab.

Capabilities

IPC-2221/2222 compliance check
Controlled impedance verification
Solder paste stencil optimisation
Panelisation and tooling design
JTAG / boundary scan integration
ICT test point coverage analysis
Flying probe test support
Functional test access review
IPC-A-610 workmanship standards
RoHS / REACH compliance
BGA and fine-pitch assembly review
Revision control and ECO support

Ready to start your project?

Get in touch with our team to discuss your requirements and receive a detailed quote.

Contact Us