Production Readiness
DFM / DFT Review
We analyse your PCB layout against your target fab's process window and your test strategy before you commit to production — so you fix problems at zero cost instead of at respin cost.
What We Deliver
DFM Analysis
Full review of trace widths, clearances, via annular rings, solder mask slivers, acid traps, and tombstoning risk — benchmarked against your fab's process capabilities.
DFT Strategy
Test point placement audit, ICT fixture compatibility review, boundary scan (JTAG) integration, and functional test access planning to maximise fault coverage.
Stackup Verification
Confirm impedance targets, dielectric thicknesses, and copper weights match your signal integrity requirements and chosen laminate materials.
Fabrication Notes
Detailed fab notes covering surface finish, via fill, controlled impedance callouts, material spec (IPC-4101), and IPC class requirements.
Assembly Documentation
Pick-and-place files, paste stencil aperture review, assembly drawings, and polarity callouts optimised for automated SMT lines.
Risk Reporting
FMEA-style risk report highlighting high-severity issues with prioritised corrective actions and expected yield impact.
Our Process
Design Intake
You share Gerbers, ODB++, schematic, BOM, and any fab/assembly constraints. We confirm scope and turnaround.
DFM Audit
Automated DRC plus manual review against your target fab's design rules. Every violation is catalogued by severity.
DFT Audit
Test point coverage mapping, ICT clearance checks, and boundary scan node review to confirm the board can be tested efficiently.
Corrections & Recommendations
We return a marked-up report with corrective actions. Critical issues include recommended Gerber edits; advisory issues are documented for your team.
Re-Review (if needed)
After you apply corrections we perform a quick re-check to confirm all critical issues are resolved before you release to fab.
Capabilities
Frequently Asked Questions
- What's included in a DFM/DFT review?
- Our DFM review checks trace widths, clearances, via annular rings, soldermask slivers, acid traps, and paste stencil apertures against your target fab's process window. The DFT review covers test point placement, ICT fixture clearances, boundary scan integration, and functional test access. You receive a severity-ranked report with corrective actions.
- What file formats do you need to perform a DFM review?
- We need Gerber files (RS-274X) or ODB++, an NC drill file, your BOM, and the schematic. If you have fab-specific design rules or a target CM in mind, sharing those lets us benchmark your design against their exact process capabilities.
- How quickly can you turn around a DFM report?
- Standard turnaround is 2-3 business days for boards up to 16 layers. Complex HDI or rigid-flex designs may require 4-5 days. Rush 24-hour turnaround is available on request.
- Do you support IPC-2221 and IPC-A-610 standards?
- Yes. Our DFM review is benchmarked against IPC-2221 (generic PCB design standard) and IPC-2222 (sectional design standard for rigid boards). Assembly acceptance criteria reference IPC-A-610 Class 2 or Class 3 depending on your product category.
Ready to start your project?
Get in touch with our team to discuss your requirements and receive a detailed quote.
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