Core Service
PCB Layout Design
From concept to production-ready layouts, we design multi-layer PCBs that meet the most demanding performance, reliability, and manufacturing requirements across all major industries.
What We Deliver
Multi-Layer Design
Expert design of complex multi-layer PCBs from 2 to 32+ layers, optimizing signal integrity and power distribution across all layers.
High-Speed Digital
Impedance-controlled routing, differential pair management, and length matching for DDR, PCIe, USB, and Ethernet interfaces.
HDI Technology
High Density Interconnect designs with microvias, blind/buried vias, and fine-pitch BGA fan-out for space-constrained applications.
EMC Compliance
Design strategies to minimize electromagnetic interference, proper grounding, shielding, and filtering for regulatory compliance.
Thermal Management
Thermal analysis and copper pour optimization, heat sink integration, and via stitching for effective heat dissipation.
Design for Manufacturing
Layouts optimized for efficient fabrication and assembly, reducing production costs and improving yield rates.
Our Process
Requirements Review
We analyze your schematic, component library, and mechanical constraints to establish design rules and stackup.
Stackup & Constraints
Define the layer stackup, impedance targets, and design constraints based on signal integrity and manufacturing requirements.
Component Placement
Strategic placement optimizing signal flow, thermal performance, and assembly efficiency with DFM considerations.
Routing & Verification
Complete routing with DRC/ERC verification, signal integrity simulation, and power integrity analysis.
Output Generation
Generate Gerber files, drill files, ODB++, assembly drawings, and fabrication notes for production.
Capabilities
Ready to start your project?
Get in touch with our team to discuss your requirements and receive a detailed quote.
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