Core Service

PCB Layout Design

From concept to production-ready layouts, we design multi-layer PCBs that meet the most demanding performance, reliability, and manufacturing requirements across all major industries.

What We Deliver

Multi-Layer Design

Expert design of complex multi-layer PCBs from 2 to 32+ layers, optimizing signal integrity and power distribution across all layers.

High-Speed Digital

Impedance-controlled routing, differential pair management, and length matching for DDR, PCIe, USB, and Ethernet interfaces.

HDI Technology

High Density Interconnect designs with microvias, blind/buried vias, and fine-pitch BGA fan-out for space-constrained applications.

EMC Compliance

Design strategies to minimize electromagnetic interference, proper grounding, shielding, and filtering for regulatory compliance.

Thermal Management

Thermal analysis and copper pour optimization, heat sink integration, and via stitching for effective heat dissipation.

Design for Manufacturing

Layouts optimized for efficient fabrication and assembly, reducing production costs and improving yield rates.

Our Process

1

Requirements Review

We analyze your schematic, component library, and mechanical constraints to establish design rules and stackup.

2

Stackup & Constraints

Define the layer stackup, impedance targets, and design constraints based on signal integrity and manufacturing requirements.

3

Component Placement

Strategic placement optimizing signal flow, thermal performance, and assembly efficiency with DFM considerations.

4

Routing & Verification

Complete routing with DRC/ERC verification, signal integrity simulation, and power integrity analysis.

5

Output Generation

Generate Gerber files, drill files, ODB++, assembly drawings, and fabrication notes for production.

Capabilities

2 to 32+ layer PCB design
Impedance-controlled routing
Differential pair routing
BGA fan-out (0.4mm pitch and below)
Rigid-flex PCB design
RF and microwave layouts
High-current power PCBs
Mixed-signal design
Backplane design
HDI with microvias
Blind and buried vias
Embedded components

Frequently Asked Questions

What layer counts do you support for PCB layout?
We support 2 to 32+ layer PCB designs. Simple boards typically use 2-4 layers; complex HDI designs with blind and buried vias can exceed 16 layers. We define the optimal stackup based on your signal integrity, power, and manufacturing requirements.
Can you handle high-speed PCB layouts for DDR4, PCIe, and USB?
Yes. High-speed digital layout is a core speciality. We apply impedance-controlled routing, differential pair length matching, and guard traces for DDR4/DDR5, PCIe Gen 3/4, USB 3.x, LVDS, and Gigabit Ethernet interfaces. All critical nets are verified against your SI targets.
What EDA tools do you use for PCB layout?
Our primary tool is Altium Designer. We also work in KiCad and can deliver native files in either format. Gerber (RS-274X), ODB++, and IPC-2581 outputs are included with every project.
Is a DFM review included with the layout?
Yes. Every layout delivery includes a DFM review against common fab rules (JLCPCB, PCBWay, or your nominated CM). We check trace clearances, via annular rings, soldermask slivers, acid traps, and assembly keepouts before releasing Gerbers.

Ready to start your project?

Get in touch with our team to discuss your requirements and receive a detailed quote.

Contact Us