Quality Assurance
Testing & Validation
We design and execute test strategies that catch defects at the lowest cost — from component-level ICT through functional validation, signal integrity measurement, and EMC pre-compliance — so your product passes certification on the first attempt.
What We Deliver
In-Circuit Test (ICT)
Bed-of-nails and flying probe ICT fixture design and test program development for component-level fault isolation at production speed.
Functional Test
End-to-end functional test sequences that exercise all operational modes, interfaces, and error conditions against defined acceptance criteria.
Signal Integrity Validation
Oscilloscope and VNA measurement of high-speed signals — eye diagrams, TDR impedance profiling, and jitter analysis for DDR, PCIe, and USB.
EMC Pre-Compliance
Near-field scanning, conducted and radiated emissions screening, and ESD susceptibility testing to catch EMC issues before formal certification.
Environmental Stress
Thermal cycling, burn-in, and HALT/HASS guidance to reveal latent defects and establish reliability margins before production release.
Failure Analysis
Root-cause investigation of test failures using X-ray, cross-sectioning, thermal imaging, and boundary scan to guide corrective action.
Our Process
Test Requirements Definition
We review your product specification, fault coverage targets, and production volume to define the right test strategy and tooling.
Test Plan
A written test plan documents every test step, pass/fail criteria, measurement equipment, and traceability to requirements.
Fixture & Programme Development
ICT fixtures, functional test jigs, and automated test scripts are developed in parallel with the PCB design to compress schedule.
Prototype Validation
First-article testing on prototype boards, including signal integrity measurements and EMC pre-scan. Issues are documented with root-cause analysis.
Production Test Hand-Off
Test documentation, fixture files, and operator instructions are packaged for transfer to your CM or in-house production line.
Yield Monitoring Support
Ongoing support to analyse production test data, tighten limits, and drive continuous yield improvement.
Capabilities
Frequently Asked Questions
- What PCB test methods do you support?
- We support in-circuit test (ICT) via flying probe or bed-of-nails fixture, functional test, JTAG/boundary scan, signal integrity measurement (oscilloscope, TDR, VNA), and EMC pre-compliance screening. We recommend the right combination based on your fault coverage targets and production volume.
- Do you perform EMC pre-compliance testing?
- Yes. We carry out near-field conducted and radiated emissions screening using a spectrum analyser and near-field probes. This identifies dominant emissions sources before you commit to a formal EMC test lab, reducing the risk of first-time failures and expensive re-tests.
- Can you design ICT test fixtures for our boards?
- Yes. We design both bed-of-nails fixtures (for volume production) and flying probe test programmes (for low-volume or pre-production). Fixture design starts during PCB layout so test point placement is optimised before the board is fabricated.
- What standards do you test against?
- Common standards we reference include IPC-A-610 (assembly acceptability), IPC-6012 (PCB qualification), MIL-STD-461 (EMC for defense), IEC 61000 (commercial EMC), and IEC 60068 (environmental testing). We scope the test plan to your specific regulatory requirements.
Ready to start your project?
Get in touch with our team to discuss your requirements and receive a detailed quote.
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