Quality Assurance

Testing & Validation

We design and execute test strategies that catch defects at the lowest cost — from component-level ICT through functional validation, signal integrity measurement, and EMC pre-compliance — so your product passes certification on the first attempt.

What We Deliver

In-Circuit Test (ICT)

Bed-of-nails and flying probe ICT fixture design and test program development for component-level fault isolation at production speed.

Functional Test

End-to-end functional test sequences that exercise all operational modes, interfaces, and error conditions against defined acceptance criteria.

Signal Integrity Validation

Oscilloscope and VNA measurement of high-speed signals — eye diagrams, TDR impedance profiling, and jitter analysis for DDR, PCIe, and USB.

EMC Pre-Compliance

Near-field scanning, conducted and radiated emissions screening, and ESD susceptibility testing to catch EMC issues before formal certification.

Environmental Stress

Thermal cycling, burn-in, and HALT/HASS guidance to reveal latent defects and establish reliability margins before production release.

Failure Analysis

Root-cause investigation of test failures using X-ray, cross-sectioning, thermal imaging, and boundary scan to guide corrective action.

Our Process

1

Test Requirements Definition

We review your product specification, fault coverage targets, and production volume to define the right test strategy and tooling.

2

Test Plan

A written test plan documents every test step, pass/fail criteria, measurement equipment, and traceability to requirements.

3

Fixture & Programme Development

ICT fixtures, functional test jigs, and automated test scripts are developed in parallel with the PCB design to compress schedule.

4

Prototype Validation

First-article testing on prototype boards, including signal integrity measurements and EMC pre-scan. Issues are documented with root-cause analysis.

5

Production Test Hand-Off

Test documentation, fixture files, and operator instructions are packaged for transfer to your CM or in-house production line.

6

Yield Monitoring Support

Ongoing support to analyse production test data, tighten limits, and drive continuous yield improvement.

Capabilities

Flying probe and bed-of-nails ICT
JTAG / boundary scan test
Functional test fixture design
Eye diagram and jitter analysis
TDR impedance measurement
VNA S-parameter characterisation
Near-field EMC scanning
Conducted/radiated pre-compliance
ESD and latch-up testing
Thermal imaging and profiling
HALT / HASS stress screening
IPC-A-610 visual inspection

Ready to start your project?

Get in touch with our team to discuss your requirements and receive a detailed quote.

Contact Us