End-to-End Service

Full-Stack Hardware Development

From a napkin sketch to a production-ready product — one team handles requirements, schematic, PCB layout, firmware, testing, and manufacturing. No coordination overhead, no gaps between disciplines.

What We Deliver

Requirements & Architecture

We translate product requirements into a hardware architecture: block diagram, component selection, risk register, and project schedule before any design work begins.

Schematic Capture

Full schematic design with component library creation, ERC sign-off, BOM, and design review — ready to hand off to layout or directly to our team.

PCB Layout

Multi-layer, high-speed, HDI, or rigid-flex PCB layout with signal integrity analysis, thermal management, and DFM built in from the start.

Firmware & BSP

Board bring-up, BSP development, peripheral drivers, RTOS integration, and communication stacks — firmware that ships with the hardware.

Testing & Validation

ICT fixture design, functional test development, signal integrity measurement, and EMC pre-compliance — so the product passes certification first time.

Manufacturing Ramp

NPI package, CM selection, first article inspection, and volume yield support — a complete hand-off to production with no gaps.

Our Process

1

Discovery & Scoping

We learn your product goals, target markets, regulatory requirements, and budget constraints to define a development roadmap with clear milestones.

2

Architecture & Component Selection

Hardware block diagram, MCU/SoC selection, power architecture, and supply chain risk review — signed off before schematic begins.

3

Schematic & BOM

Full schematic capture with design review checkpoint. BOM built with approved alternates and availability data from day one.

4

PCB Layout & DFM

Layout with co-located firmware feedback, DFM review against chosen fab, and signal integrity simulation for high-speed interfaces.

5

Prototype Build

We manage the prototype build at a trusted CM, attend or coordinate FAI, and own the bring-up process on received boards.

6

Firmware & System Validation

Board bring-up, driver development, functional test execution, and signal integrity validation on prototype hardware.

7

Production Release

Final NPI package, regulatory test support, CM transfer, and sustaining engineering hand-off — the complete product delivered.

Capabilities

Product requirements & architecture
Component selection and BOM optimisation
Schematic capture and ERC
2–32+ layer PCB layout
HDI, rigid-flex, and RF design
Firmware bring-up and BSP
FreeRTOS, Zephyr, bare-metal
Wireless: BLE, Wi-Fi, LoRa, LTE-M
ICT and functional test development
EMC pre-compliance screening
CM vetting and NPI management
Full design documentation package

Ready to start your project?

Get in touch with our team to discuss your requirements and receive a detailed quote.

Contact Us